Jedec mo 220 pdf files

Inquiries, comments, and suggestions relative to the content of this jedec standard or publication should be addressed to jedec at the address below, or call 703 07755 or. Figure 46 jedec defined package outlines for single. Copies of this document are considered uncontrolled documents. For a full list of related documents, visit our website. Mirror semiconductor mqfn preplated nipdau open air. Rambus breached jedecs patentdisclosure policies and practices, and engaged in conduct that violated the antitrust laws and section 5 of the federal trade commission act. A does not fully conform to jedec registration mo220, b all dimensions are in millimeters. By downloading this file the individual agrees not to charge for or resell the resulting material. Pick and place process and equipment is recommended and manual or hand. Jedec mo236 package saves board space fits solder footprint of industry standard 0402 1005 components aecq101 qualified sod882 package mobile phones smart phones pdas portable navigation components digital cameras portable medical components pinout 1 2 functional block diagram 1 2 life support note. Make files and information easily available to customers. 050 pitch ceramic chip carriers refer to jedec outline mo110 for complete. 32lead lead frame chip scale package lfcsp vq 5 x 5 mm.

Declaration sheet mcds, following the ipc1752 reporting format, can. Jedec standard mo 220, allows for board miniaturization, and holds several advantages. An102, assembly guidelines for qfn quad flat nolead. All specifications comply to jedec spec mo 203 issue a. Standards and documents for alternative contact information. Its scope and past activities includes standardization of part numbers, defining an electrostatic discharge esd standard. For current tape and reel information, download the pdf file from. By downloading this file the individual agrees not to charge for or resell the. Adobe acrobat reader dc software is the free global standard for reliably viewing, printing, and commenting on pdf documents. Joint jedecesda standard for electrostatic discharge sensitivity test human body model hbm component level. The package outlines have been defined based on the jedec mo 220.

Outputs from any format input and wide frequency range from. 050 pitch ceramic chip carriers refer to jedec outline mo111 for complete dimensions. 824b page 3 2 device standard contd figure 2 56pin mo # 220. As indicated in figure 1, leadless packages use perimeter lands on the bottom of the package to provide. The qfn packages are depopulated and dimensionally align with jedec standard mo241. The jedec solid state technology association is an independent semiconductor engineering trade organization and standardization body headquartered in arlington, virginia, united states jedec has over 300 members, including some of the worlds largest computer companies. Jedec mo 220 variation vjjd2, generated with kicadfootprintgenerator. Qfn + pitch p + body width x body length x height pin quantity. Jedec respectfully moves for leave to file the accompanying amicus curiae brief in support of complaint counsels appeal to the commission of the initial decision dated february 23, 2004 the decision.

Jedecmo22 thermally enhanced plastic very thin & very very thin fine pitch small outline no lead. Inconsistent with any renesas electronics data sheet, userss manual or other renesas electronics document. Data sheet adp322adp323 outline dimensions detail a jedec 5 3. Jedec_mo22wecd2 standard package name added by linear manufacturer name added by ddb manufacturer code, package name or package code added by datasheet or drawing. Trays are molded into rectangular jedec standard outlines, containing matrices of.

Browse related products from jedec solid state technology association. Published by jedec solid state technology association 200 3103 north 10th street, suite 240 south arlington, va 22201 this document may be downloaded free of charge. For qfns, the jedec mo 220 outline series generally applies. 8, jedec mo220 weed4 author freescale semiconductor, inc. 50 compliant to jedec standards mo 220 wjjd5 40 1 11 10 20 21 30 31. Jedec package mo 220 mo22 footprint mo22 mo226 mlp06j. 65mm 5 pins qty 5 jedec_mo16ab_d2pak standard package name added by datasheet or drawing. Joint ipcjedec standard for moisturereflow sensitivity classification for nonhermetic surfacemount devices. Thermally enhanced plastic very thin and very very thin.

Mktpqfn31arev4 f fairchildsemiconductor see detail a scale. Published by jedec solid state technology association 2004 2500 wilson boulevard arlington, va 222013834 this document may be downloaded free of charge. Registration thermally enhanced plastic very thin and very very thin fine pitch quad flat no lead package. Jedec solid state technology association 2011 3103 north 10th street suite 240 south arlington, va 222012107 this document may be downloaded free of charge. Compliant to jedec standards mo220vnnd4 72lead lead frame chip scale package lfcsp_vq 10 x 10 mm body, very thin quad cp721 dimensions shown in millimeters 0. On a single machine, under either computer or manual control. 20 mo r111 rab 52 mo r111 raf 20 mo r111 rbb 32 mo r111 rbe 24 mo r111 rac 68 mo r111 rag 22 mo r111 rbc 28 mo r111 rad 84 mo r111 rah square chip carriers rectangular chip carriers round lead gullwing form. 5 v 13bit to 26bit sstl_2 registered buffer for stacked ddr. 84contact, thin fine pitch quad flat nolead package code. S style the s style is a freescale version based on jedec mo220mo22, with an exception in the lead end feature.

The package outlines have been defined based on the jedec mo220. Published by jedec solid state technology association 2003 2500 wilson boulevard arlington, va 222013834 this document may be downloaded free of charge. Coplanarity applies to the exposed thermal pad as well as the terminals. Making it easier than ever to work across computers and mobile devices. A does not fully conform to jedec registration mo220, dated may2005. And now, its connected to the adobe document cloud. Download 3d step model qfn65p400x400x8016 jedec mo 220wggc. 16lead, quad, ultrathin molded leadless package umlp, 1. 8are10714d, 1601, 16, 24 terminal qfn, thermally enhanced quad flad nonleaded package, 0. Number of package outline detail graphic references. 1 the package construction allows the pinout to remain consistent with current soic, ssop, tssop, and tvsop packages. That attiny85 has a 20m1 package, which is based on the jedec mo 220 mlp, otherwise known as qfn. 14lead, thin shrink small outline package tssop, jedec. Jedec should be granted leave to file the amicus brief because jedec and its rules are the epicenter of this case.

201 page 2 3 terms and definitions contd tin and tin alloy surface finish. 20lead lead frame chip scale package lfcsp_wq 4 x 4 mm body, very very thin quad cp208 dimensions shown in millimeters 4. 18 area 13 16 p in 1 in d ic at o r ar e a op t io n s 0. Sp1003 series 30pf 30kv unidirectional discrete tvs rohs. Jedec solid state technology association 2016 3103 north 10th street suite 240 south arlington, va 222012107 this document may be downloaded free of charge. Jedec committees provide industry leadership in developing standards for a broad range of technologies. Jedec should be granted leave to file the amicus brief because jedec is at the epicenter of this case. Package design rules under jedec, document mo22 and mo 220, respectively 2, 3. Jedec motion for leave to file amicus brief before ftc. 20lead lead frame chip scale package lfcsp wq 4 x 4. 5 reflow x 3 within 15 minutes to maximum 4 hours after the moisture soak, capacitors subjected to 3x reflow soldering profile. Pub5 documents severalhundred registered outlines, standard outlines, and.

Tinbased outer surface finish for external component terminations and other exposed metal. 8asa10773d, 1101, 11, 16 terminal qfn, thermally enhanced quad, flat nonleaded package, 0. Millions of users download 3d and 2d cad files everyday. Load board onto machine and start rework process file on the computer. Published by jedec solid state technology association 2005 2500 wilson boulevard arlington, va 222013834. Compliant to jedec standards mo220vggd2 except for exposed pad dimension a 24lead lead frame chip scale package lfcsp_vq 4 x 4 mm body, very thin quad cp242 dimensions shown in millimeters 24 1 6 7 13 1 18 12 2. All dimensions are in millimeters, angles in degrees. Recommended and manual or hand soldering should be avoided. This is an editorial correction to modify the lead counts in table 5c to match those of table c for 12x12mm body 0.

16 mo r110 raa 44 mo r110 rae 18 mo r110 rba 28 mo r110 rbd 20 mo r110 rab 52 mo r110 raf 20 mo r110 rbb 32 mo r110 rbe 24 mo r110 rac 68 mo r110 rag 22 mo r110 rbc 28 mo r110 rad 84 mo r110 rah square chip carriers rectangular chip carriers round lead j form. Compliant to jedec standards mo220vggd8 a 24lead lead frame chip scale package lfcsp_vq 4 x 4 mm body, very thin quad cp243 dimensions shown in millimeters 24 1 6 7 13 1 18 12 2. Pattern datasheet, cross reference, circuit and application notes in pdf format. To surface mount plastic transistor outline header family 170p pitch 1. Processes performed during the manufacture of a component to reduce the propensity for tin whisker growth by minimizing the surface finish internal compressive stress. Package features, characteristics, and performance are defined in this application report. 20lead lead frame chip scale package lfcsp_wq 4 x 4 mm body, very very thin quad cp206 dimensions shown in millimeters top view bottom view exposed pad pin 1 or 4. 16lead, molded leadless package mlp quad, jedec mo220, 3 mm square. For over 50 years, jedec has been the global leader in developing open standards and publications for the microelectronics industry. The qfn packages outline drawings can be provided as dxf cad files on request in. This drawing conforms to jedec outline mo 220, variation vggd8.